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MOSFET a)What does it stand for? b)What's it look like? |
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Definition
a) Metal Oxide Semiconductor Field Effect Transistor b) There are two depletion regions that are small |
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PBT a)What does it stand for? b) What does it look like? |
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a) Planar Bipolar Transistor b) It has one big depletion region. |
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| What are the two techniques used to introduce dopant atoms into a silicon wafer in order to make n-type or p-type regions for IC devices? |
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Definition
| Ion Implantation and Diffusion |
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| By what process does a microscopic pattern get transferred to a silicon wafer surface of an integrated surface? |
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| Nucleation that occurs on the surface of a container or on insoluble impurities. |
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| The eutectoid structure of an Iron-Iron Carbide diagram (Alpha plus Carbide) |
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| It's the gamma + alpha phase. When steel is cooled, it nucleates and grows at the austenitic grain boundaries |
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| The alpha ferrite in the pearlite stage |
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| Nucleates in a hypereutectoid plain-carbon steel mixture, nucleates and grows primarily at the austenite grain boundaries |
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| The cementite formed by the eutectoid reaction |
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| Hard and brittle microstructure produced by rapid quenching. |
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| Where is the temperature in an Iron-Iron Carbide phase diagram where a quenched and tempered steel |
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| Where the eutectic line is |
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| What happens to the hardness of quenched steel during the tempering step? |
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| What happens to the ductility of the steel during the tempering step? |
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| At what temperature range can you perform tempering? |
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| Anywhere below the eutectoid temperature |
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| What are the three steps of the precipitation hardening process? |
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Definition
1)Solutionizing 2) Quenching 3) Aging |
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| Three steps of tempering steel process? |
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Definition
1) Austentizing 2) Quenching 3) Tempering |
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| The retarding force in homogeneous nucleation is? What's the driving force? |
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| The Surface Energy. The Volume energy |
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| In electroplating, the part that you want to electroplate needs to be the? |
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| In sacrificial corrosion, the part that you want to protect needs to be the... |
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| cathode, cathodic protection |
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| Will there be more proeutectic or eutectic alpha/beta after cooling in a phase diagram? |
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| Solutionizing should occur in... |
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| At what temperature range should aging take place? |
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| Low temperature. 130-190 Degrees |
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| What type of diffusion mechanism do dopant elements like Aluminum, Gallium, Boron, Arsenic, etc. use in Silicon |
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